
Removal of the tape exposes the compound and the heatsink is ready to be fitted to the CPU and mainboard.

The trick is to never seperate the heatsink again, because when you do, you destroy the original thermal compound's effectiveness. Here the heatsink has been folded back away from the cpu, exposing the used heat transfer compound.

I have scraped the excess, clean compound from the heatsink and used it to re-seal the joint, but it's never the same again and temps are slightly up, I find the same true when I use ordinary heatsink compound available at local stores. I haven't had the pleasure of trying Arctic Silver or similar compounds, as the price here for them is ridiculously high, so I can't comment on their effectiveness in re-sealing the joint..

Mainboard: Asus P5K-Premium, CPU=Intel E6850 @ x8x450fsb 3.6ghz, RAM: 4gb PC8500 Team Dark, Video: NV8800GT, HDD: 2x1Tb Samsung F3 RAID-0 + 1Tb F3, PSU: Antec 550 Basiq, OS: Win7x64, Display: 24&
